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PCB Hole Filling Copper vs Resin

September 27, 2021

PCB Hole Filling Copper vs Resin

While it may seem like a small aspect of the Printed Circuit Board (PCB) manufacturing process, choosing the correct method for filling in the holes can be crucial in ensuring the reliability and long-term functionality of the board. Two popular methods for filling PCB holes are using copper and resin. In this blog post, we will compare the two methods to determine which one is better suited for your needs.

Copper Hole Filling

Copper hole filling, also known as via filling, is the process of filling the holes with copper instead of leaving them empty. The method involves electroplating copper onto the surface of the board, which then fills the holes. Copper via filling has been a popular method for many years due to its reliability and low cost.

Pros of Copper Hole Filling

  • Low Cost: Copper via filling is an inexpensive method since it requires minimal equipment and resources.
  • Reliable: Copper via filling provides a stable and reliable connection since the copper is bonded to the board's surface.
  • Environmentally Friendly: Copper via filling is an eco-friendly method since it doesn't require the use of hazardous chemicals.

Cons of Copper Hole Filling

  • Time-consuming: Copper via filling can be a time-consuming process since it requires multiple stages of plating.

Resin Hole Filling

Resin hole filling, on the other hand, involves filling the holes with a resin material. The resin is typically applied using vacuum impregnation to ensure that it penetrates the hole completely. This method is newer than copper hole filling and has been growing in popularity due to its advantages.

Pros of Resin Hole Filling

  • Faster: Resin hole filling is a quicker process than copper via filling since it only requires a single application.
  • Stronger: Resin hole filling provides a stronger connection and better insulation since the resin is bonded to the board's surface.
  • No Limitations: Resin hole filling has no limitations in terms of size, shape, and thickness of the board.

Cons of Resin Hole Filling

  • Expensive: Resin hole filling can be more expensive than copper via filling since it requires more equipment and resources.
  • Hazardous: The chemicals used in the resin hole filling process can be hazardous to the environment and the workers involved.

Conclusion

In conclusion, there are pros and cons to both methods of hole filling, and the choice ultimately comes down to your specific needs and budget. Overall, copper via filling is a reliable and low-cost method that has been the go-to for many years. However, resin hole filling is a newer and more versatile option that provides a stronger and quicker connection, though at a higher cost.

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